Difference between revisions of "TEI"
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{{Event series | {{Event series | ||
| − | + | |Title =Tangible, Embedded, and Embodied Interaction | |
| − | |Title=Tangible, Embedded, and Embodied Interaction | ||
|has CORE2017 Rank=A | |has CORE2017 Rank=A | ||
| + | |Acronym=TEI | ||
| + | |pageCreator=Soeren | ||
| + | |pageEditor=Soeren | ||
| + | |contributionType=1 | ||
}} | }} | ||
Latest revision as of 20:23, 1 April 2022
TEI 

| TEI | |
|---|---|
Tangible, Embedded, and Embodied Interaction
| |
| CORE Rank (2017): | A |
| Avg. acceptance rate: | 29.7 |
| Avg. acceptance rate (last 5 years): | 29.7 |
| Table of Contents | |
Tangible, Embedded, and Embodied Interaction (TEI) has an average acceptance rate of 29.7% (last 5 years 29.7%).
Events
There are 5 events of the series TEI known to this wiki: TEI 2017, TEI 2018, TEI 2019, TEI 2020, TEI 2021
Submission/Acceptance
Locations