Difference between revisions of "IEDM 2020"
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|has program chair=Tibor Grasser | |has program chair=Tibor Grasser | ||
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| − | + | ==Call for Papers== | |
| + | Submission deadline: July 24th | ||
| + | Single submission of final, four-page paper | ||
==Topics== | ==Topics== | ||
| − | + | IEDM encourages submissions in all areas with special | |
| − | + | emphasis on: | |
| + | * Neuromorphic computing / AI | ||
| + | * Quantum computing devices | ||
| + | * Devices for RF, 5G, THz and mm-wave | ||
| + | * Advanced memory technologies | ||
| + | * Technologies for advanced logic nodes | ||
| + | * Non-charge-based devices and systems | ||
| + | * Advanced power devices, modules and systems | ||
| + | * Sensors, MEMS and bioelectronics | ||
| + | * Package-device level interactions | ||
| + | * Electron device simulation and modeling | ||
| + | * Robustness/security of electronic circuits and systems | ||
| + | * Optoelectronics, displays and imaging systems | ||
| − | == | + | ==Meeting Highlights== |
| − | * | + | * Three plenary presentations by prominent experts |
| − | + | * Special focus sessions covering topics in: | |
| − | * | + | Technologies enabling 5G and beyond |
| − | + | Future interconnect technology | |
| − | + | Device technologies for cryogenic electronics | |
| − | + | Advanced IC design and integration in widebandgap technologies | |
| − | + | Energy harvesting and wireless power transmission | |
| − | + | Next Generation Design-Technology Co-Optimization (DTCO) | |
| − | + | * Evening panel discussions | |
| − | + | * Six tutorial sessions on Saturday, December 12th | |
| − | + | * Two short courses on Sunday, December 13th | |
| − | + | * Exhibits on December 14th − 16th | |
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Revision as of 14:31, 2 June 2020
| IEDM 2020 | |
|---|---|
66th International Electron Devices Meeting
| |
| Event in series | IEDM |
| Dates | 2020/12/12 (iCal) - 2020/12/16 |
| Homepage: | https://ieee-iedm.org/ |
| Location | |
| Location: | San Francisco, California, USA |
| Important dates | |
| Submissions: | 2020/07/24 |
| Committees | |
| General chairs: | Suman Datta |
| PC chairs: | Tibor Grasser |
| Table of Contents | |
Call for Papers
Submission deadline: July 24th Single submission of final, four-page paper
Topics
IEDM encourages submissions in all areas with special emphasis on:
- Neuromorphic computing / AI
- Quantum computing devices
- Devices for RF, 5G, THz and mm-wave
- Advanced memory technologies
- Technologies for advanced logic nodes
- Non-charge-based devices and systems
- Advanced power devices, modules and systems
- Sensors, MEMS and bioelectronics
- Package-device level interactions
- Electron device simulation and modeling
- Robustness/security of electronic circuits and systems
- Optoelectronics, displays and imaging systems
Meeting Highlights
- Three plenary presentations by prominent experts
- Special focus sessions covering topics in:
Technologies enabling 5G and beyond
Future interconnect technology
Device technologies for cryogenic electronics
Advanced IC design and integration in widebandgap technologies
Energy harvesting and wireless power transmission
Next Generation Design-Technology Co-Optimization (DTCO)
- Evening panel discussions
- Six tutorial sessions on Saturday, December 12th
- Two short courses on Sunday, December 13th
- Exhibits on December 14th − 16th