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  • INTERTECH 2017
    |Field=industrial diamond, cubic boron nitride, manufacture component material, machining and grinding
    591 bytes (68 words) - 19:21, 1 April 2022
  • ECTC 2009
    of advanced packaging and novel component integration technologies involving elec- electromigration,conductive polymers and nano material based interconnects,novel
    7 KB (1,026 words) - 20:39, 1 April 2022
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