Difference between revisions of "IMPACT 2008"

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(modified through wikirestore by orapi)
(modified through wikirestore by orapi)
 
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  | Start date= 2008-10-22
 
  | Start date= 2008-10-22
 
  | Title = 3rd Intl. Microsystems, Packaging, Assembly & Circuits Technology Conf.
 
  | Title = 3rd Intl. Microsystems, Packaging, Assembly & Circuits Technology Conf.
  | wikicfpId= 3013}}
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  | wikicfpId= 3013
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<pre></pre>This CfP was obtained from [http://www.wikicfp.com/cfp/servlet/event.showcfp?eventid=3013&amp;copyownerid=2 WikiCFP]
 
<pre></pre>This CfP was obtained from [http://www.wikicfp.com/cfp/servlet/event.showcfp?eventid=3013&amp;copyownerid=2 WikiCFP]

Latest revision as of 04:44, 6 December 2021


Event Rating

median worst
Pain3.svg Pain7.svg

List of all ratings can be found at IMPACT 2008/rating

IMPACT 2008
3rd Intl. Microsystems, Packaging, Assembly & Circuits Technology Conf.
Dates 2008-10-22 (iCal) - 2008-10-24
Homepage: www.impact-emap.org/2008/CallPaper
Location
Location: TW/TPE/Taipei, TW/TPE, TW
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Important dates
Submissions: May 31, 2008
Table of Contents


This CfP was obtained from WikiCFP