Difference between revisions of "IMPACT 2008"
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| Start date= 2008-10-22 | | Start date= 2008-10-22 | ||
| Title = 3rd Intl. Microsystems, Packaging, Assembly & Circuits Technology Conf. | | Title = 3rd Intl. Microsystems, Packaging, Assembly & Circuits Technology Conf. | ||
− | | wikicfpId= 3013}} | + | | wikicfpId= 3013 |
+ | }} | ||
<pre></pre>This CfP was obtained from [http://www.wikicfp.com/cfp/servlet/event.showcfp?eventid=3013&copyownerid=2 WikiCFP] | <pre></pre>This CfP was obtained from [http://www.wikicfp.com/cfp/servlet/event.showcfp?eventid=3013&copyownerid=2 WikiCFP] |
Latest revision as of 04:44, 6 December 2021
Event Rating
median | worst |
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List of all ratings can be found at IMPACT 2008/rating
IMPACT 2008 | |
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3rd Intl. Microsystems, Packaging, Assembly & Circuits Technology Conf.
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Dates | 2008-10-22 (iCal) - 2008-10-24 |
Homepage: | www.impact-emap.org/2008/CallPaper |
Location | |
Location: | TW/TPE/Taipei, TW/TPE, TW |
Important dates | |
Submissions: | May 31, 2008 |
Table of Contents | |
This CfP was obtained from WikiCFP