Difference between revisions of "RFIC 2019"

From OPENRESEARCH fixed Wiki
Jump to navigation Jump to search
(modified through wikirestore by orapi)
(modified through wikirestore by orapi)
Line 10: Line 10:
 
|has Proceedings Bibliography=https://ieeexplore.ieee.org/xpl/conhome/8700146/proceeding
 
|has Proceedings Bibliography=https://ieeexplore.ieee.org/xpl/conhome/8700146/proceeding
 
|Acronym=RFIC 2019
 
|Acronym=RFIC 2019
|End date=2019/06/04
+
|End date=2019-06-04
 
|Series=RFIC
 
|Series=RFIC
 
|Type =Symposium
 
|Type =Symposium
Line 16: Line 16:
 
|State=US/MA
 
|State=US/MA
 
|City =US/MA/Boston
 
|City =US/MA/Boston
 +
|Year =2019
 
|Homepage=https://rfic-ieee.org/
 
|Homepage=https://rfic-ieee.org/
|Start date=2019/06/02
+
|Start date=2019-06-02
|Title=IEEE Radio Frequency Integrated Circuits Symposium
+
|Title=IEEE Radio Frequency Integrated Circuits Symposium}}
}}
 
 
The IEEE Radio Frequency Integrated Circuits Symposium (RFIC) 2019
 
The IEEE Radio Frequency Integrated Circuits Symposium (RFIC) 2019
  

Revision as of 02:50, 19 November 2021


Event Rating

median worst
Pain1.svg Pain7.svg

List of all ratings can be found at RFIC 2019/rating

RFIC 2019
IEEE Radio Frequency Integrated Circuits Symposium
Event in series RFIC
Dates 2019-06-02 (iCal) - 2019-06-04
Homepage: https://rfic-ieee.org/
Location
Location: US/MA/Boston, US/MA, US
Loading map...

Important dates
Papers: 2019/01/14
Submissions: 2019/03/22
Committees
General chairs: Stefano Pellerano
PC chairs: Waleed Khalil, Brian Floyd
Workshop chairs: Hua Wang, Danilo Manstretta
Panel Chair: Donald YC Lie
Keynote speaker: Greg Henderson, Michael Peeters
Table of Contents

The IEEE Radio Frequency Integrated Circuits Symposium (RFIC) 2019


Topics

  • Wireless Cellular and Connectivity
  • Transceiver with low power consumption
  • Receiver components and circuits
  • Analog and mixed signal blocks and SOCs
  • Reconfigurable and tunable front ends
  • Transmitter subsystems and power amplifiers
  • Oscillators
  • Frequency Synthesis
  • Equipment technologies, packaging, modelling and testing
  • Millimeter and submillimeter wave communication and detection systems
  • Emerging Circuit Technologies (NEW this year)