Difference between revisions of "RFIC 2019"
Jump to navigation
Jump to search
(modified through wikirestore by orapi) |
(modified through wikirestore by orapi) |
||
(One intermediate revision by the same user not shown) | |||
Line 10: | Line 10: | ||
|has Proceedings Bibliography=https://ieeexplore.ieee.org/xpl/conhome/8700146/proceeding | |has Proceedings Bibliography=https://ieeexplore.ieee.org/xpl/conhome/8700146/proceeding | ||
|Acronym=RFIC 2019 | |Acronym=RFIC 2019 | ||
− | |End date=2019 | + | |End date=2019-06-04 |
|Series=RFIC | |Series=RFIC | ||
|Type =Symposium | |Type =Symposium | ||
Line 16: | Line 16: | ||
|State=US/MA | |State=US/MA | ||
|City =US/MA/Boston | |City =US/MA/Boston | ||
+ | |Year =2019 | ||
|Homepage=https://rfic-ieee.org/ | |Homepage=https://rfic-ieee.org/ | ||
− | |Start date=2019 | + | |Start date=2019-06-02 |
|Title=IEEE Radio Frequency Integrated Circuits Symposium | |Title=IEEE Radio Frequency Integrated Circuits Symposium | ||
}} | }} |
Latest revision as of 03:27, 6 December 2021
Event Rating
median | worst |
---|---|
![]() |
![]() |
List of all ratings can be found at RFIC 2019/rating
RFIC 2019 | |
---|---|
IEEE Radio Frequency Integrated Circuits Symposium
| |
Event in series | RFIC |
Dates | 2019-06-02 (iCal) - 2019-06-04 |
Homepage: | https://rfic-ieee.org/ |
Location | |
Location: | US/MA/Boston, US/MA, US |
Important dates | |
Papers: | 2019/01/14 |
Submissions: | 2019/03/22 |
Committees | |
General chairs: | Stefano Pellerano |
PC chairs: | Waleed Khalil, Brian Floyd |
Workshop chairs: | Hua Wang, Danilo Manstretta |
Panel Chair: | Donald YC Lie |
Keynote speaker: | Greg Henderson, Michael Peeters |
Table of Contents | |
The IEEE Radio Frequency Integrated Circuits Symposium (RFIC) 2019
Topics
- Wireless Cellular and Connectivity
- Transceiver with low power consumption
- Receiver components and circuits
- Analog and mixed signal blocks and SOCs
- Reconfigurable and tunable front ends
- Transmitter subsystems and power amplifiers
- Oscillators
- Frequency Synthesis
- Equipment technologies, packaging, modelling and testing
- Millimeter and submillimeter wave communication and detection systems
- Emerging Circuit Technologies (NEW this year)