Difference between revisions of "MEMS 2009"
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| Acronym= MEMS 2009 | | Acronym= MEMS 2009 | ||
| − | | End date= 2009 | + | | End date= 2009-01-29 |
| Series= MEMS | | Series= MEMS | ||
| Type = Conference | | Type = Conference | ||
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| State = IT/72 | | State = IT/72 | ||
| City = IT/72/Sorrento | | City = IT/72/Sorrento | ||
| + | | Year = 2009 | ||
| Homepage= www.mems2009.org | | Homepage= www.mems2009.org | ||
| − | | Start date= 2009 | + | | Start date= 2009-01-25 |
| Title = IEEE 22nd International Conference on Micro Electro Mechanical Systems | | Title = IEEE 22nd International Conference on Micro Electro Mechanical Systems | ||
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Latest revision as of 04:21, 6 December 2021
Event Rating
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List of all ratings can be found at MEMS 2009/rating
| MEMS 2009 | |
|---|---|
IEEE 22nd International Conference on Micro Electro Mechanical Systems
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| Event in series | MEMS |
| Dates | 2009-01-25 (iCal) - 2009-01-29 |
| Homepage: | www.mems2009.org |
| Location | |
| Location: | IT/72/Sorrento, IT/72, IT |
| Important dates | |
| Submissions: | Aug 24, 2008 |
| Notification: | Sep 26, 2008 |
| Table of Contents | |
Reflecting the rapid growth of the MEMS field and the commitment and success of its research community, the IEEE MEMS Conference series has evolved into a premier annual event in the MEMS area. In recent years it has attracted over 600 participants and has presented more than 200 select papers in non-overlapping oral and poster sessions. The 22nd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2009) will be held in Sorrento, Italy, from 25 - 29 January 2009. The major areas of activity in the development of MEMS solicited and expected at this conference include but are not limited to:
* Design, simulation and analysis tools with experimental verification
* Fabrication technologies and processes
* Silicon and non-silicon materials
* Electro-mechanical integration techniques
* Assembly and packaging approaches
* Metrology and operational evaluation techniques
* System architecture
The major areas of activity in the application of MEMS solicited and expected at this conference include but are not limited to:
* Mechanical, thermal, and magnetic sensors and actuators, and system
* Opto-mechanical microdevices and microsystems
* Fluidic microcomponents and microsystems
* Microdevices for data storage
* Microdevices for biomedical engineering
* Micro chemical analysis systems
* Microdevices and systems for wireless communication
* Microdevices for power supply and energy harvesting
* Nano-electro-mechanical devices and systems
* Scientific microinstruments
Abstract Submission Deadline:
24 August 2008
Notice of Acceptance:
26 September 2008
Final Camera Ready Due:
21 October 2008
Early Bird Registration Deadline:
30 September 2008
This CfP was obtained from WikiCFP