Difference between revisions of "IRPS 2020"
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{{Event | {{Event | ||
| + | |has general chair=Gaudenzio Meneghesso | ||
| + | |has program chair=Charles Slayman | ||
|Acronym=IRPS 2020 | |Acronym=IRPS 2020 | ||
| − | | | + | |End date=2020-05-30 |
|Series=IRPS | |Series=IRPS | ||
| − | |Type=Conference | + | |Type =Conference |
| − | | | + | |Country=US |
| − | | | + | |State=US/TX |
| + | |City =US/TX/Dallas | ||
| + | |Year =2020 | ||
|Homepage=https://irps.org/ | |Homepage=https://irps.org/ | ||
| − | | | + | |Start date=2020-04-28 |
| − | | | + | |Title=2020 IEEE International Reliability Physics Symposium |
| − | |||
| − | |||
| − | |||
}} | }} | ||
Sollte eigentlich vom 29.03.2020-02.04.2020 in Dallas, Texas, USA stattfinden, wurde aufgrund der COVID-19 Pandemie aber zeitlich verschoben und als Online-Konferenz abgehalten. | Sollte eigentlich vom 29.03.2020-02.04.2020 in Dallas, Texas, USA stattfinden, wurde aufgrund der COVID-19 Pandemie aber zeitlich verschoben und als Online-Konferenz abgehalten. | ||
Latest revision as of 04:04, 6 December 2021
Event Rating
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List of all ratings can be found at IRPS 2020/rating
| IRPS 2020 | |
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2020 IEEE International Reliability Physics Symposium
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| Event in series | IRPS |
| Dates | 2020-04-28 (iCal) - 2020-05-30 |
| Homepage: | https://irps.org/ |
| Location | |
| Location: | US/TX/Dallas, US/TX, US |
| Committees | |
| General chairs: | Gaudenzio Meneghesso |
| PC chairs: | Charles Slayman |
| Table of Contents | |
Sollte eigentlich vom 29.03.2020-02.04.2020 in Dallas, Texas, USA stattfinden, wurde aufgrund der COVID-19 Pandemie aber zeitlich verschoben und als Online-Konferenz abgehalten.
Topics of Interest
IRPS 2021 is soliciting increased participation in the following special focus topic areas.
- Circuit Reliability and Aging – RAS, self-healing, aging aware designs, design tools
- Emerging memory / Neuromorphic Computing– Reliability for PCM, MRAM, RRAM, ferroelectrics
- Reliability of RF/mmW/5G Devices – CMOS, SiGe BiCMOS, SOI, GaAs, GaN
Papers in the following areas are requested.
Circuits, Products, and Systems
- Circuit Reliability and Aging
- IC Product Reliability
- System Electronics Reliability
- Soft Errors
- ESD and Latchup
- Packaging and 2.5D/3D Assembly
- Reliability Testing
- Silicon Photonics
- RF/mmW/5G
Materials, Processing, and Devices
- Transistors
- Gate/MOL Dielectrics
- Beyond CMOS Devices
- Neuromorphic Computing Reliability
- Wide-Bandgap Semiconductors
- Compound and Optoelectronic Devices
- Metallization/BEOL Reliability
- Process Integration
- Failure Analysis
- Memory Reliability
- Photovoltaics
- MEMS