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  • INTERTECH 2017
    |Field=industrial diamond, cubic boron nitride, manufacture component material, machining and grinding
    536 bytes (63 words) - 13:25, 17 February 2021
  • ECTC 2009
    of advanced packaging and novel component integration technologies involving elec- electromigration,conductive polymers and nano material based interconnects,novel
    7 KB (1,023 words) - 12:22, 17 February 2021
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