TEI

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Event series
TEI
Tangible, Embedded, and Embodied Interaction
CORE Rank (2017): A
Avg. acceptance rate: 29.7
Avg. acceptance rate (last 5 years): 29.7
Table of Contents

Tangible, Embedded, and Embodied Interaction (TEI) has an average acceptance rate of 29.7% (last 5 years 29.7%).

Events

There are 5 events of the series TEI known to this wiki: TEI 2017, TEI 2018, TEI 2019, TEI 2020, TEI 2021

 OrdinalOrdinal of the event e.g. 1 for 1st.YearFromToCityCountrypresenceHomepageGNDdblpWikiCFPWikidataUsed to provide the identifier with which an entity is indexed in Wikidata.General chairPC chairAcceptance rate
TEI 20212021Feb 14Feb 17SalzburgAustriahttps://tei.acm.org/2021/Martin Kaltenbrunner
Martin Murer
Katrin Wolf
Ian Oakley
TEI 20202020Feb 9Feb 12SydneyAustraliahttps://tei.acm.org/2020/participate/call-for-papers/Elise van den Hoven
Lian Loke
Orit Shaer
Jelle van Dijk
Andrew Kun
28.0
TEI 20192019Mar 17Feb 20TempeUShttps://tei.acm.org/2019/Stacey Kuznetsov
Daniel Saakes
Ron Wakkary
Luc Geurts
Lauren Hayes
Manfred Lau
32.7
TEI 20182018Mar 18Mar 21StockholmSwedenhttps://tei.acm.org/2018/Ylva Fernaeus
Martin Jonsson
Audrey Girouard
Jakob Tholander
28.5
TEI 20172017Mar 20Mar 23YokohamaJapanhttp://www.tei-conf.org/17/index.html


Submission/Acceptance

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Locations

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