IEEE ECCE 2019

IEEE ECCE 2019
11th IEEE Energy Conversion Congress and Exposition
Event in series	IEEE ECCE
Dates	2019/09/29 (iCal) - 2019/10/03
Homepage:	http://www.ieee-ecce.org/2019/
Location
Location:	Baltimore, Maryland, USA
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Papers:	Submitted 1779 / Accepted 1087 (61.1 %)
Committees
General chairs:	Yan-Fei Liu
PC chairs:	Brad Lehman, Bulent Sarlioglu, Yilmaz Sozer, Jian Sun
Table of Contents

Event

The Eleventh Annual IEEE Energy Conversion Congress and Exposition (ECCE 2019) will be held in Baltimore, Maryland, USA on September 29 – October 3, 2019. ECCE is a pivotal international event on energy conversion. ECCE 2019 will feature both industry-driven and application-oriented technical sessions, as well as expositions.

• Major topics:
• Energy Conversion Systems and Applications
• Renewable and alternative energy
• Smart grids, micro-grids, and utility applications
• Electrical energy storage
• Energy conversion for Information Technology and communication systems
• Energy harvesting
• Energy efficiency for residential, commercial and industrial applications
• Wireless power transfer (WPT)
• Lighting applications and displays
• Transportation electrification
• High power/voltage power conversion
• High voltage isolation and lightning strike protection
• Component, Converter and Subsystem Technologies
• Power electronic devices (Si and wide band-gap) and applications
• Power conversion topologies, modulation, and control
• Modeling and control of components, converters and systems
• Rotating/linear electro-mechanical devices and drive systems
• Passive components and materials
• Power electronic packaging, integration, and advanced manufacturing
• Reliability, diagnostics, prognostics, and health management
• EMI and EMC
• Thermal management, advanced cooling technologies

General Chair: Yan-Fei Liu, Queen’s University, Canada

Technical Program Committee (TPC) Co-Chairs: Brad Lehman, Northeastern University, USA Bulent Sarlioglu, University of Wisconsin-Madison, USA Yilmaz Sozer, University of Akron, USA Jian Sun, Rensselaer Polytechnic Institute, USA